Wafer drying machine is widely used in wet cleaning process and is one of the main equipment of wet cleaning. It is not only used for silicon wafers, but also for washing and spinning of materials such as masks and solar cells with high cleanliness. In addition, SRD equipment is commonly used in the drying process of various substrate materials in the semiconductor manufacturing process.
A.Equipment overview
1.1 Applications: Wafer dryer is a high cleanliness washing and drying equipment, with high clean washing, high-speed drying, fast drying, high efficiency characteristics, different wafer sizes, can be quickly replaced by the rotor to achieve. Is the main equipment of wet cleaning process, the equipment itself has single chamber and double chamber two kinds of structure, small size and smooth operation. It is mainly used for high cleanliness washing and drying process of 2-8 inch semiconductor wafers, mask plates, various substrates and other materials.
1.2 Name: Double chamber dryer
1.3 Model: SemiTool 870S
B.Main technical parameters
Project | Main performance indicators and parameters |
Processing wafer size | 2-6 inch discs |
Quantity of drying per session | 50 |
Number of stations | 2 |
Particle increment | Customer requirement |
Rotation speed RPM/MIN | 200-2200 |
Drying time | 5-8min |
Chamber and nitrogen heating method | Electric heater |
Nitrogen pressure | 0.25-0.3Mpa, pipe connector 3/8" |
Nitrogen consumption L/min | 80 |
Pure water pressure | 0.25-0.3Mpa, pipe connector 3/8" |
Drain pipe | 40mm round pipe PVC pipe |
Control system | Mitsubishi PLC programmable controller |
Display | 4.3-inch touch screen |
Power source | AC220V |
Overall power | 5 KW |
Dimensions (depth * width * height) mm | 710mm*460mm*1850mm |