Wafer dryer is a device used to clean and dry wafers in the semiconductor manufacturing process and is widely used in the semiconductor manufacturing field. Its main function is to dry the water on the wafer through high-speed rotation to ensure the cleanliness and dry state of the wafer surface, thus providing a good basis for subsequent process steps.
A.Equipment overview
1.1 Applications: Wafer dryer is a high cleanliness washing and drying equipment, with high clean washing, high-speed drying, fast drying, high efficiency characteristics, different wafer sizes, can be quickly replaced by the rotor to achieve. It is the main equipment of wet cleaning process, and the equipment itself has two kinds of structures, single chamber and double chamber, small size and stable operation. It is mainly used for high cleanliness washing and drying process of 2-8 inch semiconductor wafers, mask plates, various substrates and other materials.
1.2 Name: Double chamber dryer
1.3 Model: CSM880S
1.4 Size: 710mm*520mm*1850mm
1.5 Wafer size: 2-8 inches
1.6 Material: Stainless steel frame +10mm PP plate shell
1.7 Equipment frame: SUS304 stainless steel material, can meet the working environment of clean room.
1.8 The cavity and carrier are made of corrosion-resistant SUS316L stainless steel and electrochemically polished. The carrier can be easily replaced.
1.9 The motor and rotor are treated by precise dynamic balance to reduce the resonance of the equipment.
Deionized water rotary rinse + centrifugal dry nitrogen drying
Recommended process parameters:
Stage | Rinse | Drying | Drying1 | Drying2 |
Time | 60s | 30s | 200S | 100S |
Speed | 800r/min | 1000r/min | 1800r/min | 1500r/min |
Medium | Deionized water | Nitrogen | Nitrogen | Nitrogen |
Nitrogen temperature | No | 0° | 80° | 80° |
C.Main technical parameters
Project | Main performance indicators and parameters |
Processing wafer size | 2-8 inch discs |
Quantity of drying per session | 50 |
Number of stations (units) | 2 |
Fragmentation rate | ≤0.01% |
Particle increment | According to customer environment and product requirements |
Rotational speed RPM/MIN | 200-2000 |
Time for drying | 5-8min |
Chamber and nitrogen heating method | Electric heater |
nitrogen gas pressure | 0.25-0.3Mpa,Nitrogen pipe connector3/8” |
Nitrogen consumption L/min | 90 |
Pure water pressure | 0.25-0.3Mpa， pipe 3/8” |
Diain-pipe | 40mmRound pipe PVC pipe |
Control system | Mitsubishi PLC programmable controller |
Display | 4.3-inch touch screen |
Power supply | AC220V |
Machine power | 6 KW |
Dimensions (D * W * H) mm | 710mm*520mm*1850mm |